Display panel and method for manufacturing the same

ABSTRACT

A display panel comprises a first substrate including a pixel area defined, and a second substrate disposed under the first substrate and including a light emitting element that emits first light to the first substrate. The first substrate includes a base layer, a color filter layer disposed under the base layer and disposed in the pixel area, a light control layer disposed under the color filter layer, and a first opening between the color filter layer and the light control layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional patent application claims priority to and thebenefit of Korean Patent Application No. 10-2020-0063195 under 35 U.S.C.§ 119, filed in the Korean Intellectual Property Office (KIPO) on May26, 2020, the entire contents of which are incorporated herein byreference.

BACKGROUND

The disclosure relates to a display panel having improved light outputefficiency and a method for manufacturing the display panel.

Display panels may include a light control layer to implement colors.The light control layer may include pigment particles having apredetermined color or luminous bodies emitting a predetermined color.In case that light provided to a pixel area is provided to an adjacentlight control layer, the light output efficiency of display panels maybe affected because of failure to control part of the light.

SUMMARY

The disclosure provides a display panel having improved light outputefficiency and a method for manufacturing the display panel.

An embodiment provides a display panel including a first substrateincluding a pixel area, and a second substrate disposed under the firstsubstrate and including a light emitting element that emits first lightto the first substrate. The first substrate may include a base layer, acolor filter layer disposed under the base layer and disposed in thepixel area, a light control layer disposed under the color filter layer,and a first opening between the color filter layer and the light controllayer.

The color filter layer and the light control layer may be spaced apartfrom each other, and the first opening is between the color filter layerand the light control layer.

In a plan view, the color filter layer may overlap the light controllayer and the first opening.

Air may be disposed in the first opening.

A refractive index inside the first opening may be about 1 to about 1.1.

a refractive index inside the first opening may be lower than arefractive index of the light control layer and a refractive index ofthe color filter layer.

The display panel may further include a first protective layer disposedbetween the color filter layer and the light control layer, and a secondprotective layer disposed between the first protective layer and thelight control layer. The first opening may be between a portion of thefirst protective layer and a portion of the second protective layer, andthe portion of the first protective layer and the portion of the secondprotective layer may be spaced apart from each other.

The first opening may be in the pixel area in a plan view.

The first substrate may comprise at least one second opening connectedto the first opening in an area adjacent to the pixel area in the firstsubstrate in a plan view.

The first substrate may comprise a third opening connected to the firstopening in an area adjacent to the pixel area in the first substrate inthe plan view, the third opening may be spaced apart from the at leastone second opening, and the first opening may be between the thirdopening and the at least one second opening in the plan view.

The at least one second opening and the third opening may not overlapthe light control layer.

The first substrate may comprise a plurality of second openings, theplurality of second openings may be spaced apart from each other, andthe pixel area is disposed between the plurality of second openings.

The light emitting element may overlap the first opening, the colorfilter layer, and the light control layer.

The first light passing through the light control layer may be definedas second light, and a part of the second light may be totally reflectedby a surface adjacent to the first opening.

In an embodiment, a method for manufacturing a display panel may includeforming a first substrate including a pixel area, and bonding the firstsubstrate and a second substrate to each other. The second substrate maycomprise a light emitting element corresponding to the pixel area of thefirst substrate. The forming of the first substrate may include forminga color filter layer on a base layer, forming a photoresist layer on thecolor filter layer, forming an encapsulation layer on the photoresistlayer, forming a light control layer on the encapsulation layer,removing a portion of the encapsulation layer, and removing thephotoresist layer to form a first opening.

The removing of a portion of the encapsulation layer may include forminga second opening in an area adjacent to the pixel area of the firstsubstrate.

The forming of the first opening may include removing the photoresistlayer through the second opening.

The forming of the first substrate may include forming a plurality ofbarrier ribs on the encapsulation layer, and the forming of the lightcontrol layer may comprise disposing the light control layer between theplurality of barrier ribs.

The forming of the plurality of barrier ribs may be provided after theforming of the photoresist layer and before the forming of the lightcontrol layer.

The forming of the plurality of barrier ribs may be provided after theforming of the first opening.

BRIEF DESCRIPTION OF THE DRAWINGS

An additional appreciation according to the embodiments of thedisclosure will become more apparent by describing in detail theembodiments thereof with reference to the accompanying drawings,wherein:

FIG. 1 is a schematic perspective view of a display panel according toan embodiment;

FIG. 2 is a schematic cross-sectional view of a display panel accordingto an embodiment;

FIG. 3 is a schematic plan view of a display panel according to anembodiment;

FIG. 4 is a schematic cross-sectional view of a display panel accordingto an embodiment;

FIGS. 5A to 5C are schematic cross-sectional views illustrating a partof a method for manufacturing a display panel according to anembodiment;

FIG. 5D is a schematic plan view illustrating a part of a method formanufacturing a display panel according to an embodiment;

FIG. 5E is a schematic cross-sectional view taken along line II-II′ ofFIG. 5D according to an embodiment;

FIG. 5F is a schematic cross-sectional view illustrating a part of amethod for manufacturing a display panel according to an embodiment; and

FIGS. 6A to 6D are schematic cross-sectional views illustrating a partof a method for manufacturing a display panel according to anembodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the description, when an element (or a region, a layer, a portion,etc.) is referred to as being “on,” “connected to,” or “coupled to”another element, it means that the element may be directly disposedon/connected to/coupled to the other element, or that a third elementmay be disposed therebetween.

Like reference numerals refer to like elements. Also, in the drawings,the thickness, the ratio, and the dimensions of elements may beexaggerated for an effective description of technical contents.

The term “and/or,” includes all combinations of one or more of whichassociated configurations may define. For example, “A and/or B” may beunderstood to mean “A, B, or A and B.” In the specification and theclaims, the phrase “at least one of” is intended to include the meaningof “at least one selected from the group of” for the purpose of itsmeaning and interpretation. For example, “at least one of A and B” maybe understood to mean “A, B, or A and B.”

It will be understood that, although the terms “first,” “second,” andthe like may be used herein to describe various elements, these elementsshould not be limited by these terms. These terms are only used todistinguish one element from another. For example, a first element couldbe termed a second element, and, similarly, a second element could betermed a first element, without departing from the scope of exampleembodiments. The terms of a singular form may include plural formsunless the context clearly indicates otherwise.

The terms such as “below,” “lower,” “above,” “upper,” and the like areused to describe the relationship of the configurations shown in thedrawings. The terms are used as a relative concept and are describedwith reference to the direction indicated in the drawings.

Unless otherwise defined or implied herein, all terms (includingtechnical and scientific terms) used herein have the same meaning ascommonly understood by those skilled in the art to which this disclosurepertains. It will be further understood that terms, such as thosedefined in commonly used dictionaries, should be interpreted as having ameaning that is consistent with their meaning in the context of therelevant art and the disclosure, and should not be interpreted in anideal or excessively formal sense unless clearly so defined herein.

It should be understood that the terms “comprise,” “include,” or “have”are intended to specify the presence of stated features, integers,steps, operations, elements, components, or combinations thereof in thedisclosure, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components, orcombinations thereof.

Hereinafter, some embodiments will be described with reference to theaccompanying drawings.

FIG. 1 is a schematic perspective view of a display panel according toan embodiment.

Referring to FIG. 1, a display area DA and a non-display area NDA may bedefined in the display panel DP. The non-display area NDA may beadjacent to the display area DA.

The display area DA may be an area for displaying an image. Thenon-display area NDA may be an area in which an image is not displayed.Pixels PX may be disposed in the display area DA. The pixels PX may notbe disposed in the non-display area NDA. The pixels PX may refer toeffective pixels providing an image.

The display area DA may be parallel to a plane defined by a firstdirection DR1 and a second direction DR2. The normal direction of thedisplay area DA, which is the thickness direction of the display panelDP, is indicated as a third direction DR3. A front surface (or an uppersurface) and a rear surface (or a lower surface) of each member may bedefined in the third direction DR3. The term “on a plane” or “in a planview” may be defined as viewing the object from above in the thirddirection DR3.

The display panel DP may not only be used for large-sized electronicdevices such as a television set, a monitor, or an outdoor billboard butalso used for small- and medium-sized electronic devices such as apersonal computer, a laptop computer, a personal digital terminal, a carnavigation unit, a game console, a portable electronic device, and acamera. These are merely presented as an example, and thus it may beadopted for other electronic devices without departing from thedisclosure.

A bezel area of the display panel DP may be defined by the non-displayarea NDA. The non-display area NDA may be an area adjacent to thedisplay area DA. The non-display area NDA may surround the display areaDA. However, the embodiments are not limited thereto, and the shape ofthe display area DA and the shape of the non-display area NDA may berelatively designed. In an embodiment, the non-display area NDA may beomitted.

The display panel DP may include a first substrate 100 and a secondsubstrate 200. The first substrate 100 may include a pixel area and alight blocking area, and the second substrate 200 may include lightemitting elements. This will be described below.

FIG. 2 is a schematic cross-sectional view of a display panel accordingto an embodiment.

Referring to FIG. 2, the display panel DP may include a first substrate100 and a second substrate 200. The first substrate 100 and the secondsubstrate 200 may face each other and be spaced apart from each other.Accordingly, a predetermined cell gap GP may be provided between thefirst substrate 100 and the second substrate 200.

A filling layer may be disposed in the cell gap GP. The filling layerwill be described below.

The cell gap GP may be maintained by a sealant SLM bonding the firstsubstrate 100 and the second substrate 200. The sealant SLM may includean organic adhesive member or an inorganic adhesive member. The sealantSLM may include frits.

FIG. 3 is a schematic plan view of a display panel according to anembodiment.

Referring to FIG. 3, first pixel areas PXA1, second pixel areas PXA2,third pixel areas PXA3, and a light blocking area NPXA are defined inthe first substrate 100 of the display panel DP. The display panel DPprovides first color light through the first pixel areas PXA1, thesecond pixel areas PXA2 provide second color light, and the third pixelareas PXA3 provide third color light. The first color light, the secondcolor light, and the third color light each may have different colorsfrom one another. For example, the first color light may be green light,the second color light may be blue light, and the third color light maybe red light.

The first pixel areas PXA1 may be arranged in the first direction DR1and the second direction DR2. The shapes of the third pixel areas PXA3and the shapes of first pixel areas PXA1 may be symmetrical about anaxis extending in the first direction DR1. Each of the second pixelareas PXA2 may be disposed between corresponding one of the first pixelareas PXA1 and corresponding one of the third pixel areas PXA3. Whenviewed in the second direction DR2, a portion of the second pixel areasPXA2 may not overlap the first pixel areas PXA1 and the third pixelareas PXA3. However, this is presented as an example, and the shape andarrangement relationship of the pixel areas according to an embodimentare not limited thereto. For example, the first pixel areas PXA1, thesecond pixel areas PXA2, and the third pixel areas PXA3 may have anarrangement relationship of a stripe structure as being arrangedsequentially in the second direction DR2.

In FIG. 3, areas of the first pixel areas PXA1 and the third pixel areasPXA3 each are equal to each other, and although areas of the secondpixel areas PXA2 are illustrated to be smaller than the areas of thefirst pixel areas PXA1 and the areas of the third pixel areas PXA3, theareas of the pixel areas according to an embodiment are not limitedthereto. For example, the area of each of the third pixel areas PXA3 maybe larger than the area of each of the first pixel areas PXA1, and thearea of each of the first pixel areas PXA1 may be larger than the areaof each of the second pixel areas PXA2.

The light blocking area NPXA may be disposed adjacent to the first pixelareas PXA1, the second pixel areas PXA2, and the third pixel areas PXA3.The light blocking area NPXA may set boundaries of the first pixel areasPXA1, the second pixel areas PXA2, and the third pixel areas PXA3. Thelight blocking area NPXA may prevent color mixing among the first pixelareas PXA1, the second pixel areas PXA2, and the third pixel areas PXA3.The light blocking area NPXA may prevent the source light from beingprovided to a user.

FIG. 4 is a schematic cross-sectional view of a display panel accordingto an embodiment.

Referring to FIG. 4, the display panel DP according to an embodiment maybe a light emitting display panel but is not particularly limitedthereto. For example, the display panel DP may be an organic lightemitting display panel, a nano LED display panel, a micro LED displaypanel, or a quantum dot light emitting display panel. An emission layerof the organic light emitting display panel may include an organic lightemitting material. An emission layer of the quantum dot light emittingdisplay panel may include a quantum dot and a quantum rod. Emissionlayers of the nano LED display panel and the micro LED display panel mayinclude small LED elements having a size equal to or smaller thanseveral hundred micrometers. Hereinafter, the display panel DP isdescribed as an organic light emitting display panel.

The display panel DP may include a first substrate 100, a filling layerFL, and a second substrate 200. The first substrate 100 may be a lightcontrol substrate. The second substrate 200 may be a display substrate.For example, the first substrate 100 may include a wavelength conversionmaterial and/or a material blocking a specific wavelength band. Thesecond substrate 200 may provide light or control light transmittance.

The first substrate 100 and the second substrate 200 may face eachother. The filling layer FL may be disposed between the first substrate100 and the second substrate 200. The filling layer FL may fill a cellgap GP (see FIG. 2) between the first substrate 100 and the secondsubstrate 200.

The first substrate 100 may include a base layer BS1, color filterlayers CF1, CF2, and CF3, a light blocking layer BM1, light controllayers WCL1, WCL2, TL, and barrier ribs BM2.

The base layer BS1 may be a silicon substrate, a plastic substrate, aglass substrate, an insulating film, or a laminate structure includinginsulating layers.

The light blocking layer BM1 may be disposed on a surface of the baselayer BS1. The light blocking layer BM1 may define a light blocking areaNPXA. The light blocking layer BM1 may not overlap the first pixel areasPXA1, the second pixel areas PXA2, and the third pixel areas PXA3.

The color filter layers CF1, CF2, and CF3 may include a first colorfilter layer CF1, a second color filter layer CF2, and a third colorfilter layer CF3. The first color filter layer CF1 may be disposed on asurface of the base layer BS1. The first color filter layer CF1 may bedisposed under the base layer BS1. The first color filter layer CF1 maybe a red color filter layer.

The second color filter layer CF2 may be disposed on a surface of thebase layer BS1. The second color filter layer CF2 may be disposed underthe base layer BS1. The second color filter layer CF2 may be a greencolor filter layer.

The third color filter layer CF3 may be disposed on a surface of thebase layer BS1. The third color filter layer CF3 may be disposed underthe base layer BS1. The third color filter layer CF3 may be a blue colorfilter layer.

The first color filter layer CF1 may be disposed in each of the thirdpixel areas PXA3. The second color filter layer CF2 may be disposed ineach of the first pixel areas PXA1. The third color filter layer CF3 maybe disposed in each of the second pixel areas PXA2.

A first protective layer L1 may cover or overlap the color filter layersCF1, CF2, and CF3, and the light blocking layer BM1. The firstprotective layer L1 may include an inorganic material. For example, theinorganic material may include any one among silicon oxide, siliconnitride, or silicon oxy nitride.

A second protective layer L2 may be disposed under the first protectivelayer L1. The second protective layer L2 may include an inorganicmaterial. For example, the inorganic material may include any one amongsilicon oxide, silicon nitride, or silicon oxy nitride.

Light control layers WCL1, WCL2, and TL may include a first lightcontrol layer WCL1, a second light control layer WCL2, and a third lightcontrol layer TL. The light control layers WCL1, WCL2, and TL may bedisposed under the second protective layer L2.

The first light control layer WCL1 may be disposed under the first colorfilter layer CF1. The first light control layer WCL1 may be disposed inthe third pixel area PXA3. The first light control layer WCL1 mayinclude a first base resin BR1, first scattering particles SC1, and afirst luminous body EP1.

The second light control layer WCL2 may be disposed under the secondcolor filter layer CF2. The second light control layer WCL2 may bedisposed in the first pixel area PXA1. The second light control layerWCL2 may include a second base resin BR2, second scattering particlesSC2, and a second luminous body EP2.

The third light control layer TL may be disposed under the third colorfilter layer CF3. The third light control layer TL may be disposed inthe second pixel area PXA2. The third light control layer TL may includea third base resin BR3 and third scattering particles SC3.

The first to third base resins BR1, BR2, and BR3 are media in whichluminous bodies or scattering particles are dispersed and may include(or be formed of) various resin compositions, which may be generallyreferred to as a binder. However, the embodiments are not limitedthereto, and as long as the media are capable of dispersing the luminousbodies or scattering particles, the media may be referred to as a baseresin regardless of names, additional functions, constituent materials,etc. For example, the base resin may be a polymer resin. As anotherexample, the base resin may be an acrylic-based resin, a urethane-basedresin, a silicone-based resin, an epoxy-based resin, etc. In anembodiment, the base resin may be a transparent resin.

The first to third scattering particles SC1, SC2, and SC3 may be TiO₂ orsilica-based nanoparticles. The first to third scattering particles SC1,SC2, and SC3 may scatter light. Because of lack of a luminous body inthe third light control layer, the amount of the third scatteringparticles SC3 included in the third light control layer TL may be equalto or greater than the amount of each of the first scattering particlesSC1 included in the first light control layer WCL1 and second scatteringparticles SC2 included in the second light control layer WCL2. Inanother embodiment, the first and second scattering particles SC1 andSC2 may be omitted.

Each of the first luminous body EP1 and the second luminous body EP2 maybe particles converting wavelengths of light. For example, each of thefirst luminous body EP1 and the second luminous body EP2 may be aquantum dot, a quantum rod, or a phosphor.

A quantum dot has a crystalline structure of a few nanometers in size,contains hundreds to thousands of atoms, and exhibits a quantumconfinement effect in which the energy band gap is increased due to itssmall size. In case that light of a wavelength having greater energythan the band gap is incident on the quantum dot, the quantum dotabsorbs the light to be excited and falls to a ground state whileemitting light of a specific wavelength. The emitted light of thespecific wavelength has a value corresponding to the band gap. In casethat the quantum dot is adjusted in size and composition, light emittingproperties due to the quantum confinement effect may be controlled.

The core of the quantum dot may include a Group II-VI compound, a GroupIII-VI compound, a Group compound, a Group III-V compound, a Group IV-VIcompound, a Group IV element, a Group IV compound, or a combinationthereof.

The Group II-VI compound may be selected from the group consisting of abinary compound selected from the group consisting of CdS, CdSe, CdTe,ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and a mixture thereof,a ternary compound selected from the group consisting of CdSeS, CdSeTe,CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe,CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, anda mixture thereof, and a quaternary compound selected from the groupconsisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe,CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and a mixture thereof.

The Group III-VI compound may include a binary compound such as In₂S₃and In₂Se₃, a ternary compound such as InGaS₃ and InGaSe₃, or anycombination thereof.

The Group semiconductor compound may include a ternary compound such asAgInS, AgInS₂, CuInS, CuInS₂, AgGaS₂, CuGaS₂, CuGaO₂, AgGaO₂, AgAlO₂, orany combination thereof.

The Group III-V compound may be selected from the group consisting of abinary compound selected from the group consisting of GaN, GaP, GaAs,GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and a mixture thereof,a ternary compound selected from the group consisting of GaNP, GaNAs,GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InAlP,InNP, InNAs, InNSb, InPAs, InPSb, and a mixture thereof, and aquaternary compound selected from the group consisting of GaAlNP,GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs,GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, and a mixturethereof. The Group III-V compound may further include a Group II metal.For example, InZnP, etc. may be selected as a Group III-II-V compound.

The Group IV-VI compound may be selected from the group consisting of abinary compound selected from the group consisting of SnS, SnSe, SnTe,PbS, PbSe, PbTe, and a mixture thereof, a ternary compound selected fromthe group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe,SnPbS, SnPbSe, SnPbTe, and a mixture thereof, and a quaternary compoundselected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe, and amixture thereof. The Group IV element may be selected from the groupconsisting of Si, Ge, and a mixture thereof. The Group IV compound maybe a binary compound selected from the group consisting of SiC, SiGe,and a mixture thereof.

In this case, a binary compound, a ternary compound, or a quaternarycompound may be present in a particle with a uniform concentrationdistribution or may be present in the same particle with a partiallydifferent concentration. The quantum dot may have a core/shell structurein which a quantum dot surrounds another quantum dot. An interfacebetween a core and a shell may have a concentration gradient in whichthe concentration of an element present in the shell becomes lowertoward the center.

In some embodiments, a quantum dot may have a core/shell structureincluding a core having nano-crystals and a shell surrounding the coredescribed above. The shell of the quantum dot may function as aprotection layer to prevent the chemical deformation of the core so asto maintain semiconductor properties, and/or a charging layer to impartelectrophoresis properties to the quantum dot. The shell may be a singlelayer or a multilayer. An interface between the core and the shell mayhave a concentration gradient in which the concentration of an elementpresent in the shell becomes lower toward the center. An example of thequantum dot shell may be a metal or non-metal oxide, a semiconductorcompound, or a combination thereof.

For example, the metal or non-metal oxide may be a binary compound suchas SiO₂, Al₂O₃, TiO₂, ZnO, MnO, Mn₂O₃, Mn₃O₄, CuO, FeO, Fe₂O₃, Fe₃O₄,CoO, Co₃O₄, and NiO, or a ternary compound such as MgAl₂O₄, CoFe₂O₄,NiFe₂O₄, and CoMn₂O₄ but the embodiments are not limited thereto.

The semiconductor compound may be, for example, CdS, CdSe, CdTe, ZnS,ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP,InGaP, InSb, AlAs, AlP, AlSb, etc., but the embodiments are not limitedthereto.

A quantum dot may have a full width of half maximum (FWHM) of a lightemitting wavelength spectrum equal to or smaller than about 45 nm,preferably about 40 nm, more preferably about 30 nm, and the colorpurity or color reproducibility may be improved in the above ranges.Light emitted through such a quantum dot is emitted in all directions sothat a wide viewing angle may be improved.

The form of a quantum dot is not particularly limited as long as it iscommonly used in the art. For example, a quantum dot in the form ofspherical, pyramidal, multi-arm, or cubic nanoparticles, nanotubes,nanowires, nanofibers, nanoplates particles, etc. may be used. However,the embodiments are not limited thereto and may include any formcommonly used in the art.

A quantum dot may control the color of emitted light according to theparticle size thereof and thus the quantum dot may have various lightemission colors such as green, red, etc.

According to an embodiment, in case that the first luminous body EP1 andthe second luminous body EP2 are quantum dots, the particle size of thefirst luminous body EP1 and the particle size of the second luminousbody EP2 may be different from each other. For example, the particlesize of the first luminous body EP1 may be larger than the particle sizeof the second luminous body EP2. In this case, the first light luminousbody EP1 may emit light having a longer wavelength than the secondluminous body EP2.

The first light control layer WCL1 may convert blue light into red lightto provide the converted light to the first color filter layer CF1. Thefirst color filter layer CF1 may transmit light in a wavelength range ofred light and may absorb other light.

The second light control layer WCL2 may convert blue light into greenlight to provide the converted light to the second color filter layerCF2. The second color filter layer CF2 may transmit light in awavelength range of green light and may absorb other light.

The third light control layer TL may scatter blue light to provide thescattered light to the third color filter layer CF3. The third colorfilter layer CF3 may transmit light in a wavelength range of blue lightand may absorb other light.

The third protective layer L3 may be disposed under the light controllayers WCL1, WCL2, and TL. The third protective layer L3 may cover oroverlap the light control layers WCL1, WCL2, and TL. The thirdprotective layer L3 may include any one among silicon oxide, siliconnitride, or silicon oxy nitride. In another embodiment, the thirdprotective layer L3 may be omitted.

A first opening HA1 may be defined among the first to third color filterlayers CF1, CF2, and CF3, and the light control layers WCL1, WCL2, andTL. For example, the first opening HA1 may be defined between the firstprotective layer L1 and the second protective layer L2.

The first to third color filter layers CF1, CF2, and CF3, and the lightcontrol layers WCL1, WCL2, and TL may be spaced apart from each other inthe third direction DR3 with the first opening HA1 therebetween.

In a plan view, the first to third color filter layers CF1, CF2, CF3,the light control layers WCL1, WCL2, and TL, and the first opening HA1may overlap each other.

Air may be disposed inside the first opening HA1.

The refractive index inside the first opening HA1 may be smaller thanthe refractive index of the light control layers WCL1, WCL2, and TL. Therefractive index of the first opening HA1 (or the material in the firstopening HA1 such as air) may be smaller than the refractive index of thefirst to third color filter layers CF1, CF2, and CF3. The refractiveindex inside the first opening HA1 may be about 1 to about 1.1. Forexample, the refractive index inside the first opening HA1 may be about1.

In a plan view, the first opening HA1 may be defined in the first tothird pixel areas PXA1, PXA2, and PXA3.

Barrier ribs BM2 may be spaced apart from each other with the lightcontrol layers WCL1, WCL2, and TL therebetween. The barrier ribs BM2 mayoverlap the light blocking layer BM1.

The second substrate 200 may include a base layer BS2, a circuit layerCCL, a light emitting element layer EL, and a thin film encapsulationlayer TFE. The circuit layer CCL may be disposed on the base layer BS2.The circuit layer CCL may include insulating layers, conductive layers,and a semiconductor layer. The light emitting element layer EL may bedisposed on the circuit layer CCL. The thin film encapsulation layer TFEmay overlap or seal the light emitting element layer EL. In anembodiment, the thin film encapsulation layer TFE may be omitted.

The base layer BS2 may be a silicon substrate, a plastic substrate, aglass substrate, an insulating film, or a laminate structure includinginsulating layers.

The circuit layer CCL may include first to third transistors TR1, TR2,and TR3, and insulating layers IL1, IL2, IL3, and IL4. The insulatinglayers IL1, IL2, IL3, and IL4 may include a first insulating layer IL1,a second insulating layer IL2, a third insulating layer IL3, and afourth insulating layer IL4.

The first insulating layer IL1 may be disposed on the base layer BS2,and the first to third transistors TR1, TR2, and TR3 may be disposed onthe first insulating layer IL1, The first to third transistors TR1, TR2,and TR3 may have substantially the same structure. Therefore, the firsttransistor TR1 is described as a representative. The first transistorTR1 may include a control electrode CE, an input electrode IE, an outputelectrode OE, and a semiconductor layer ACL.

The semiconductor layer ACL may be disposed on the first insulatinglayer ILL The first insulating layer IL1 may be a buffer layer providinga modified surface to the semiconductor layer ACL. In this case, thesemiconductor layer ACL may have a higher adhesion to the firstinsulating layer IL1 than the base layer BS2. The first insulating layerIL1 may protect a lower surface of the semiconductor layer ACL. In thiscase, the first insulating layer IL1 may prevent the base layer BL2itself or may prevent contamination or moisture introduced through thebase layer BL2 from penetrating into the semiconductor layer ACL. Asanother example, the first insulating layer IL1 may be a light blockinglayer blocking external light incident through the base layer BS2 fromentering the semiconductor layer ACL. In this case, the first insulatinglayer IL1 may further include a light blocking material.

The semiconductor layer ACL may include polysilicon or amorphoussilicon. The semiconductor layer ACL may include a metal oxidesemiconductor. The semiconductor layer ACL may include a channel areafunction as a passage through which electrons or holes may move, and afirst doped area and a second doped area disposed with the channel areatherebetween.

The second insulating layer IL2 may be disposed on the first insulatinglayer ILL The second insulating layer IL2 may cover or overlap thesemiconductor layer ACL. The second insulating layer IL2 may include aninorganic material. The inorganic material may include at least any oneamong silicon nitride, silicon oxy nitride, silicon oxide, titaniumoxide, and aluminum oxide.

The control electrode CE may be disposed on the second insulating layerIL2. The third insulating layer IL3 may be disposed on the secondinsulating layer IL2 and may overlap the control electrode CE. The thirdinsulating layer IL3 may include (or be formed of) a single layer ormultiple layers. For example, the single layer may include an inorganiclayer. The layers may include an organic layer and an inorganic layer.

The input electrode IE and the output electrode OE may be disposed onthe third insulating layer IL3. The input electrode IE and the outputelectrode OE may be electrically connected to the semiconductor layerACL via through holes penetrating the second insulating layer IL2 andthe third insulating layer IL3.

The fourth insulating layer IL4 may be disposed on the third insulatinglayer IL3 and may overlap or cover the input electrode IE and the outputelectrode OE. The fourth insulating layer IL4 may include (or be formedof) a single layer or a multiple layers. For example, the single layermay include an organic layer. The layers may include an organic layerand an inorganic layer. The fourth insulating layer IL4 may be aplanarization layer providing a flat upper surface.

The light emitting element layer EL may be disposed on the fourthinsulating layer IL4. The light emitting element layer EL may includelight emitting elements ED1, ED2 and ED3, and a pixel defining film PDL.

The light emitting elements ED1, ED2, and ED3 may overlap the firstopening HAL the color filter layers CF1, CF2, and CF3, and the lightcontrol layers WCL1, WCL2, and TL, respectively. The light emittingelements ED1, ED2, and ED3 may include a first light emitting elementED1, a second light emitting element ED2, and a third light emittingelement ED3.

The first light emitting element ED1 may be disposed corresponding tothe third pixel area PXA3. The first light emitting element ED1 mayoverlap the third pixel area PXA3 in a plan view. The first lightemitting element ED1 may include a first electrode E1-1, a firstemission layer EML-1, and a second electrode E2-1.

The second light emitting element ED2 may be disposed corresponding tothe first pixel area PXA1. The second light emitting element ED2 mayoverlap the first pixel area PXA1 in a plan view. The second lightemitting element ED2 may include a first electrode E1-2, a secondemission layer EML-2, and a second electrode E2-2.

The third light emitting element ED3 may be disposed corresponding tothe second pixel area PXA2. The third light emitting element ED3 mayoverlap the second pixel area PXA2 in a plan view. The third lightemitting element ED3 may include a first electrode E1-3, a thirdemission layer EML-3, and a second electrode E2-3.

The first electrodes E1-1, E1-2, and E1-3 may be disposed on the fourthinsulating layer IL4. The first electrodes E1-1, E1-2, and E1-3 may beelectrically connected to the first to third transistors TR1, TR2, andTR3, respectively, via through holes.

The pixel defining film PDL may expose at least portions of each of thefirst electrodes E1-1, E1-2, and E1-3. The pixel defining film PDL mayoverlap barrier ribs BM2. The pixel defining film PDL may overlap alight blocking layer BM1.

The first to third emission layers EML-1, EML-2, and EML-3 according toan embodiment may be connected to one another to form an emission layer(or may be integral with each other). For example, the first to thirdemission layers EML-1, EML-2, and EML-3 may be disposed on the pixeldefining film PDL and the first electrodes E1-1, E1-2, and E1-3. Thefirst to third emission layers EML-1, EML-2, and EML-3 may generate bluelight. The first to third emission layers EML-1, EML-2, and EML-3 mayhave a tandem structure or a single-layer structure.

The second electrodes E2-1, E2-2, and E2-3 may be connected to oneanother to form a second electrode (or may be integral with each other).The second electrodes E2-1, E2-2, and E2-3 may be disposed on the firstto third emission layers EML-1, EML-2, and EML-3, respectively.

Although not separately illustrated, a hole control layer may bedisposed between the first electrode and the emission layer, and anelectron control layer may be disposed between the emission layer andthe second electrode. The hole control layer may be classified as atleast one among a hole injection region, a hole transport region, abuffer region, and an electron blocking region. The electron controllayer may be classified as at least one among an electron injectionregion, an electron transport region, and a hole blocking region.

The thin film encapsulation layer TFE may be disposed on the secondelectrodes E2-1, E2-2, and E2-3. The thin film encapsulation layer TFEmay cover or overlap the second electrodes E2-1, E2-2, and E2-3. Inanother embodiment, a capping layer overlapping the second electrodesE2-1, E2-2, and E2-3 may be further disposed between the thin filmencapsulation layer TFE and the second electrodes E2-1, E2-2, and E2-3.In another embodiment, the thin film encapsulation layer TFE may beomitted.

The thin film encapsulation layer TFE may include a first inorganiclayer ECL1, an organic layer ECL2, and a second inorganic layer ECL3,which are sequentially stacked. The organic layer ECL2 may be disposedbetween the first inorganic layer ECL1 and the second inorganic layerECL3. The first inorganic layer ECL1 and the second inorganic layer ECL3may be formed through depositing an inorganic material, and the organiclayer ECL2 may be formed through depositing, printing, or coating anorganic material.

The first inorganic layer ECL1 and the second inorganic layer ECL3protect the light emitting element layer EL from moisture and oxygen,and the organic layer ECL2 protects the light emitting element layer ELfrom foreign substances such as dust particles. The first inorganiclayer ECL1 and the second inorganic layer ECL3 may include at least anyone among silicon nitride, silicon oxynitride, silicon oxide, titaniumoxide, and aluminum oxide. The organic layer ECL2 may include a polymer,for example, an acrylic-based organic layer. However, this is present asan example, and the embodiments are not limited thereto.

In FIG. 4, the thin film encapsulation layer TFE is illustrated toinclude two inorganic layers and an organic layer as an example but isnot limited thereto. For example, the thin film encapsulation layer TFEmay include three inorganic layers and two organic layers, and in thiscase, the inorganic layer and the organic layer may have a structure ofbeing alternately stacked. As another example, the thin filmencapsulation layer TFE may be provided as a single layer.

The filling layer FL may be disposed between a lower surface of each ofthe third protective layer L3 and the barrier ribs BM2, and an uppersurface of the second inorganic layer ECL3. The filling layer FL may bedisposed between the thin film encapsulation layer TFE and the lightcontrol layers WCL1, WCL2, and TL to prevent the light control layersWCL1, WCL2, and TL from contacting the thin film encapsulation layerTFE, thereby improving light output efficiency of the display panel DP.The filling layer FL may be formed between the thin film encapsulationlayer TFE and the light control layers WCL1, WCL2, and TL to prevent aninner space from being created between the thin film encapsulation layerTFE and the light control layers WCL1, WCL2, and TL.

The filling layer FL may prevent luminous bodies and/or scatteringparticles included in the light control layers WCL1, WCL2, and TL frombeing oxidized by internal air, and thus increasing light outputefficiency of the display panel DP.

The filling layer FL may include an inorganic binder, an organic binder,or a liquid crystal compound. However, this is presented as an example,and the material of the filling layer FL according to an embodiment isnot limited thereto.

The display panel DP may be manufactured by bonding a first substrate100, a filling layer FL, and a second substrate 200 to each other.

The light emitting elements ED1, ED2, and ED3 may provide first lightLT1 to the first substrate 100. For example, the first light LT1 may beblue light. The first light LT1 may be referred to as source light. Thefirst light LT1 may be provided to the light control layers WCL1, WCL2,and TL.

The first light LT1 passing through the light control layers WCL1, WCL2,and TL may be defined as second light LT2. The second light LT2 mayinclude the first light LT1 and light which is the converted first lightLT1 by the luminous bodies EP1 and EP2. For example, the second lightLT2 may include at least one among red light, green light, and bluelight. The second light LT2 may be provided to the color filter layersCF1, CF2, and CF3.

In an embodiment, the second light LT2 may be provided to the firstopening HA1 from the light control layers WCL1, WCL2, and TL. The firstopening HA1 may be filled with air. The refractive index of the lightcontrol layers WCL1, WCL2, and TL may be higher than the refractiveindex of inside the first opening HAL A part of the second light LT2 maybe totally reflected on a plane (or layer) HA1-B defining the firstopening HA1. The light that is not converted by the light control layersWCL1, WCL2, and TL in the part of the totally reflected second light LT2is converted in the light control layers WCL1, WCL2, and TL, and isre-provided to the color filter layers CF1, CF2, and CF3. Accordingly, adisplay panel DP having improved light output efficiency may beprovided.

The second light LT2 passing through the first light control layer WCL1may include red light and blue light. In case that the second light LT2is provided to the first color filter layer CF1, the blue light isabsorbed, and thus the light output efficiency of the display panel DPmay be reduced. However, in an embodiment, a first part of the secondlight LT2 totally reflected in the first opening HA1 overlapping thefirst light control layer WCL1 may include red light and blue light. Thefirst light control layer WCL1 may convert blue light into red lightamong the first part of the totally reflected second light LT2 toprovide the converted light back to the first color filter layer CF1.

The second light LT2 passing through the second light control layer WCL2may include green light and blue light. In case that the second lightLT2 is provided to the second color filter layer CF2, the blue light isabsorbed, and thus the light output efficiency of the display panel DPmay be reduced. However, in an embodiment, a second part of the secondlight LT2 totally reflected in the first opening HA1 overlapping thesecond light control layer WCL2 may include green light and blue light.The second light control layer WCL2 may convert blue light into greenlight among the second part of the totally reflected second light LT2 toprovide the converted light back to the second color filter layer CF2.

Table 1 compares light output efficiency based on refractive indicesaccording to an embodiment.

TABLE 1 Refractive index light output efficiency (%) Comparative Example1 1.23 100.0% Comparative Example 2 1.19 106.0% Example 1.00 128.5%

Referring to Table 1 and FIG. 4, Comparative Example 1 of Table 1 may bea display panel having a first low refractive layer with a refractiveindex of about 1.23 between the color filter layers CF1, CF2, and CF3and the light control layers WCL1, WCL2, and TL. First light outputefficiency of Comparative Example 1 may be set to a reference value ofabout 100.0%. Comparative Example 2 of Table 1 may be a display panelhaving a second low refractive layer with a refractive index of about1.19 between the color filter layers CF1, CF2, and CF3 and the lightcontrol layers WCL1, WCL2, and TL, wherein the refractive index is lowerthan that of the first low refractive layer. Second light outputefficiency of Comparative Example 2 may be about 106.0%, which is higherthan the first light output efficiency.

Example of Table 1 may be a display panel DP according to an embodiment.A first opening HA1 may be defined between the color filter layers CF1,CF2, and CF3 and the light control layers WCL1, WCL2, and TL, and therefractive index inside the first opening HA1 may be about 1.00. Therefractive index inside the first opening HA1 may be lower than therefractive index of each of the first low refractive layer and thesecond low refractive layer. Third light output efficiency of Examplemay be about 128.5%, which is higher than each of the first light outputefficiency and the second light output efficiency. According to thedisclosure, a display panel DP having improved light output efficiencymay be provided.

FIGS. 5A to 5C are schematic cross-sectional views illustrating a partof a method for manufacturing a display panel according to anembodiment.

Referring to FIG. 5A, a method for manufacturing a display panel DP (seeFIG. 4) may include forming a first substrate 100 (see FIG. 4). A lightblocking layer BM1 may be formed on a base layer BS1. The light blockinglayer BM1 may overlap a light blocking area NPXA. The light blockinglayer BM1 and any one of color filter layers CF1, CF2, and CF3 mayinclude (or be formed of) the same material. For example, the lightblocking layer BM1 and the third color filter layer CF3 may include thesame material.

The color filter layers CF1, CF2, and CF3 may be formed on the baselayer BS1. The color filter layers CF1, CF2, and CF3 may overlap pixelareas PXA1, PXA2, and PXA3. The first color filter layer CF1, the secondcolor filter layer CF2, and the third color filter layer CF3 may bespaced apart from one another in the second direction DR2. However, thisis presented as an example, and the arrangement relationship of thecolor filter layers CF1, CF2, and CF3 according to an embodiment is notlimited thereto. For example, portions of each of the first color filterlayer CF1, the second color filter layer CF2, and the third color filterlayer CF3 may be disposed to overlap one another.

A first protective layer L1 may be formed on the color filter layersCF1, CF2, and CF3. The first protective layer L1 may overlap or coverthe light blocking layer BM1 and the color filter layers CF1, CF2, andCF3.

After the color filter layers CF1, CF2, and CF3 are formed, photoresistlayers PR1, PR2, and PR3 may be formed on the first protective layer L1.The photoresist layers PR1, PR2, and PR3 may include a first photoresistlayer PR1, a second photoresist layer PR2, and a third photoresist layerPR3. The photoresist layers PR1, PR2, and PR3 may overlap the colorfilter layers CF1, CF2, and CF3, respectively. For example, the firstphotoresist layer PR1 may overlap the first color filter layer CF1, thesecond photoresist layer PR2 may overlap the second color filter layerCF2, and the third photoresist layer PR3 may overlap the third colorfilter layer CF3.

A second protective layer L2 may be formed on the photoresist layersPR1, PR2, and PR3. The second protective layer L2 may overlap or coverthe first protective layer L1 and the photoresist layers PR1, PR2, andPR3. The second protective layer L2 may be referred to as anencapsulation layer L2.

Referring to FIG. 5B, after the second protective layer L2 is formed,barrier ribs BM2 may be formed on the second protective layer L2. Thebarrier ribs BM2 in the light blocking area NPXA may overlap the lightblocking area NPXA. The barrier ribs BM2 may not overlap the pixel areasPXA1, PXA2, and PXA3.

After the barrier ribs BM2 are formed, a first nozzle NZ1 may providefirst ink INK1 to the third pixel area PXA3. The first ink INK1 may forma first light control layer WCL1 (see FIG. 4). A second nozzle NZ2 mayprovide second ink INK2 to the first pixel area PXA1. The second inkINK2 may form a second light control layer WCL2 (see FIG. 4). A thirdnozzle NZ3 may provide third ink INK3 to the second pixel area PXA2. Thethird ink INK3 may form a third light control layer TL (see FIG. 4).

The first ink INK1, the second ink INK2, and the third ink INK3 may beprovided simultaneously.

Referring to FIG. 5C, light control layers WCL1, WCL2, and TL may beformed on the photoresist layers PR1, PR2, and PR3, respectively. Thelight control layers WCL1, WCL2, and TL may be disposed between barrierribs BM2.

The light control layers WCL1, WCL2, and TL may be formed by an inkjetprocess.

A third protective layer L3 may be formed on the light control layersWCL1, WCL2, and TL, and the barrier ribs BM2. The third protective layerL3 may cover or overlap the light control layers WCL1, WCL2, and TL, andthe barrier ribs BM2.

FIG. 5D is a schematic plan view illustrating a part of a method formanufacturing a display panel according to an embodiment, and FIG. 5E isa schematic cross-sectional view taken along line II-II′ of FIG. 5Daccording to an embodiment.

Referring to FIGS. 5D and 5E, after the third protective layer L3 isformed, a portion of the second protective layer L2 and a portion of thethird protective layer L3 in an area adjacent to the pixel areas PXA1,PXA2, and PXA3 may be removed. A second opening HA2 may be formed by theremoved portion of the second protective layer L2.

The second opening HA2 may not overlap the light control layers WCL1,WCL2, and TL. The second opening HA2 may be defined in an area adjacentto the pixel areas PXA1, PXA2, and PXA3. For example, a second openingHA2 may be formed in an adjacent area of the first pixel area PXA1; twosecond openings HA2 may be formed in an adjacent region of the secondpixel area PXA2; and a second opening HA2 may be formed in an adjacentarea of the third pixel area PXA3.

The second openings HA2 may be spaced apart from each other with thepixel areas PXA1, PXA2, and PXA3 therebetween. For example, a secondopening HA2 a may be formed in an area adjacent to the first pixel areaPXA1, and a second opening HA2 b may be formed in an area adjacent tothe other first pixel area PXA1. The second opening HA2 b may bereferred to as a third opening HA2 b.

A second opening HA2 may be formed in an area adjacent to the firstpixel area PXA1. Two second openings HA2 may be formed in an areaadjacent to the second pixel area PXA2. The two second openings HA2 maybe spaced apart from each other with the second pixel area PXA2therebetween. A second opening HA2 may be formed in an area adjacent tothe third pixel area PXA3. However, this is presented as an example, andin an embodiment, the same number of the second openings HA2 may beprovided in each of the pixel areas, or different numbers of the secondopenings HA2 may be provided in each of the pixel areas.

The second openings HA2 a and HA2 b may be spaced apart from each otherin the first direction DR1. The second openings HA2 a and HA2 b may beprovided with the second photoresist layer PR2 therebetween.

Steps before the forming of the second opening HA2 may be performed at atemperature equal to or less than a predetermined temperature. Forexample, the predetermined temperature may be about 150° C. Thephotoresist layers PR1, PR2, and PR3 manufactured below thepredetermined temperature are not cured and may thus be easily removed.

After the second opening HA2 is formed, the first opening HA1 (see FIG.4) may be formed. The first opening HA1 (see FIG. 4) may be formed byremoving the photoresist layers PR1, PR2, and PR3 through the secondopening HA2. For example, a side surface of the second photoresist layerPR2 may be exposed by the second opening HA2 a.

A photoresist removal solution may be provided in the second opening HA2a. The photoresist removal solution may remove the second photoresistlayer PR2.

The second photoresist layer PR2 is removed, and thus the secondopenings HA2 a and HA2 b may be connected to each other. In anembodiment, the first opening HA1 and the second openings HA2 a and HA2b may be connected to one another. The photoresist removal solution isprovided to the first opening HA1 through one of the second openings HA2a or HA2 b to be discharged from the first opening HA1 through the otherof the second openings HA2 a and HA2 b. In this case, removing thephotoresist layers PR1, PR2, and PR3 may be performed better than incase that the photoresist removal solution is provided to the firstopening HA1 through a second opening HA2.

FIG. 5F is a schematic cross-sectional view illustrating a part of amethod for manufacturing a display panel according to an embodiment.

Referring to FIG. 5F, an area in which the photoresist layers PR1, PR2,and PR3 are disposed may be removed to form a first opening HA1. Thefirst opening HA1 may be filled with air.

After the first opening HA1 is formed, a first substrate 100 may bebonded to a second substrate 200 (see FIG. 4) to manufacture a displaypanel DP (see FIG. 4).

FIGS. 6A to 6D are schematic cross-sectional views illustrating a partof a method for manufacturing a display panel according to anembodiment.

Referring to FIG. 6A, a light blocking layer BM1 may be formed on a baselayer BS1. A first color filter layer CF1, a second color filter layerCF2, and a third color filter layer CF3 may be formed on the lightblocking layer BM1. At least portions of the first color filter layerCF1, the second color filter layer CF2, and the third color filter layerCF3 may overlap one another. However, this is presented as an example,and the first color filter layer CF1, the second color filter layer CF2,and the third color filter layer CF3 according to an embodiment may bespaced apart from one another and not overlap each. A first protectivelayer L1 may be formed on the first color filter layer CF1, the secondcolor filter layer CF2, and the third color filter layer CF3.

Referring to FIG. 6B, a first light control layer WCL1 may be formed onthe first color filter layer CF1. A second light control layer WCL2 maybe formed on the second color filter layer CF2. Thereafter, a thirdprotective layer L3-1 overlapping the first light control layer WCL1 andthe second light control layer WCL2 may be formed.

A third light control layer TL may be formed on the third color filterlayer CF3. The third light control layer TL may be disposed on the thirdprotective layer L3-1.

The light control layers WCL1, WCL2, and TL may be formed through apatterning process. A mask may be used in the patterning process. Lightcontrol layers WCL1, WCL2, and TL may be formed through subsequentexposure and development processes.

A portion of the second protective layer L2 in an area adjacent to thepixel areas PXA1, PXA2, and PXA3 may be removed. The photoresist layersPR1, PR2, and PR3 may be exposed by a portion of the removed secondprotective layer L2.

Referring to FIG. 6C, a photoresist removal solution may be provided tothe exposed photoresist layers PR1, PR2, and PR3 (see FIG. 6B). Thephotoresist layers PR1, PR2, and PR3 (see FIG. 6B) may be removedthrough the photoresist removal solution to form a first opening HA1.Air may be filled in the first opening HA1.

Referring to FIG. 6D, after the first opening HA1 is formed, liquidrepellent treatment may be performed on the first opening HAL In casethat barrier ribs BM2 are formed by the liquid repellent treatment, amaterial forming the barrier ribs BM2 may not be introduced into thefirst opening HA1.

A barrier ribs BM2 may be formed in a light blocking area NPXA. Thebarrier ribs BM2 may not overlap the pixel areas PXA1, PXA2, and PXA3.The barrier ribs BM2 may be formed to be spaced apart from each otherwith the light control layers WCL1, WCL2, and TL therebetween.

After the barrier ribs BM2 are formed, a first substrate 100 and asecond substrate 200 (see FIG. 4) are bonded to each other tomanufacture a display panel DP (see FIG. 4).

In an embodiment, light provided from an emission layer may be providedto an opening defined between a color filter layer and a light controllayer. The refractive index of the light control layer may be higherthan the refractive index inside the opening. A part of the lightpassing through the light control layer may be totally reflected on alower surface of the opening. Light that is not converted by the lightcontrol layer in a part of the totally reflected light may be convertedin the light control layer and may be provided back to the color filterlayer. Accordingly, a display panel having improved light outputefficiency may be provided.

Although the disclosure has been described with reference to someembodiments, it will be understood that the disclosure should not belimited to these embodiments but various changes and modifications canbe made by those skilled in the art without departing from the spiritand scope of the disclosure.

Accordingly, the technical scope of the claimed invention is notintended to be limited to the contents set forth in the detaileddescription of the specification, but is intended to be defined by theappended claims.

What is claimed is:
 1. A display panel comprising: a first substrateincluding a pixel area; and a second substrate disposed under the firstsubstrate and including a light emitting element that emits first lightto the first substrate, wherein the first substrate comprises: a baselayer; a color filter layer disposed under the base layer and disposedin the pixel area; a light control layer disposed under the color filterlayer; and a first opening between the color filter layer and the lightcontrol layer.
 2. The display panel of claim 1, wherein the color filterlayer and the light control layer are spaced apart from each other, andthe first opening is between the color filter layer and the lightcontrol layer.
 3. The display panel of claim 1, wherein in a plan view,the color filter layer overlaps the light control layer and the firstopening.
 4. The display panel of claim 1, wherein air is disposed in thefirst opening.
 5. The display panel of claim 1, wherein a refractiveindex inside the first opening is about 1 to about 1.1.
 6. The displaypanel of claim 1, wherein a refractive index inside the first opening islower than a refractive index of the light control layer and arefractive index of the color filter layer.
 7. The display panel ofclaim 1, further comprising: a first protective layer disposed betweenthe color filter layer and the light control layer; and a secondprotective layer disposed between the first protective layer and thelight control layer, wherein the first opening is between a portion ofthe first protective layer and a portion of the second protective layer,and the portion of the first protective layer and the portion of thesecond protective layer are spaced apart from each other.
 8. The displaypanel of claim 1, wherein the first opening is in the pixel area in aplan view.
 9. The display panel of claim 1, wherein the first substratecomprises at least one second opening connected to the first opening inan area adjacent to the pixel area in the first substrate in a planview.
 10. The display panel of claim 9, wherein the first substratecomprises a third opening connected to the first opening in an areaadjacent to the pixel area in the first substrate in the plan view, thethird opening is spaced apart from the at least one second opening, andthe first opening is between the third opening and the at least onesecond opening in the plan view.
 11. The display panel of claim 10,wherein the at least one second opening and the third opening do notoverlap the light control layer.
 12. The display panel of claim 9,wherein the first substrate comprises a plurality of second openings,the plurality of second openings are spaced apart from each other, andthe pixel area is disposed between the plurality of second openings. 13.The display panel of claim 1, wherein the light emitting elementoverlaps the first opening, the color filter layer, and the lightcontrol layer.
 14. The display panel of claim 1, wherein the first lightpassing through the light control layer is defined as second light, anda part of the second light may be totally reflected by a surfaceadjacent to the first opening.
 15. A method for manufacturing a displaypanel, the method comprising: forming a first substrate including apixel area; and bonding the first substrate and a second substrate toeach other, wherein the second substrate comprises a light emittingelement corresponding to the pixel area of the first substrate, whereinthe forming of the first substrate comprises: forming a color filterlayer on a base layer; forming a photoresist layer on the color filterlayer; forming an encapsulation layer on the photoresist layer; forminga light control layer on the encapsulation layer; removing a portion ofthe encapsulation layer; and removing the photoresist layer to form afirst opening.
 16. The method of claim 15, wherein the removing of aportion of the encapsulation layer comprises forming a second opening inan area adjacent to the pixel area of the first substrate.
 17. Themethod of claim 16, wherein the forming of the first opening comprisesremoving the photoresist layer through the second opening.
 18. Themethod of claim 15, wherein the forming of the first substrate comprisesforming a plurality of barrier ribs on the encapsulation layer, and theforming of the light control layer comprises disposing the light controllayer between the plurality of barrier ribs.
 19. The method of claim 18,wherein the forming of the plurality of barrier ribs is provided afterthe forming of the photoresist layer and before the forming of the lightcontrol layer.
 20. The method of claim 18, wherein the forming of theplurality of barrier ribs is provided after the forming of the firstopening.